Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
Emerging II
Time:
Thursday, 12/Sept/2024:
3:45pm - 5:15pm

Session Chair: Martin Schneider-Ramelow, Fraunhofer IZM
Location: MOA 4

MOA 4

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Presentations

10 Golden Rules of Chip- Package- Board Interactions

Evelyn Napetschnig

Infineon technologies Austria AG, Graz, Austria



Trench-Based Fully Integrated Capacitors for Power Delivery in Heterogeneous Integration Platforms

Yousef Safari, Yushu Zhao, Boris Vaisband

ECE Department, McGill University, Montreal, Canada



Sustainable Temperature and Pressure Sensing Solution for Tire

Kimmo Antero Keränen1, Timo Kurkela1, Jyrki Ollila1, Antti Tanskanen1, Marko Korkalainen1, Antoine Balin2

1VTT Technical Research Centre of Finland, Espoo, Finland; 2Continental Reifen Deutschland GmbH, Germany