Conference Agenda

Session

AP5_Advances in WLP Technologies II

Time:

Thursday, 12/Sept/2024:

1:45pm - 3:15pm

Session Chair: Michael Schiffer, Fraunhofer IZM

Location: MOA 5

MOA 5

Presentations

1:45pm - 2:10pm

Package Assembly Design Kits (PADK’s) – The Future of Advanced Wafer-level Manufacturing

Ruben Fuentes

Amkor Technology, United States of America

2:10pm - 2:35pm

Fan-out Packaging Reaching New Heights: Market and Technology Overview

Gabriela Pereira

Yole Group, Villeurbanne, France

2:35pm - 3:00pm

Optimizing Laser Direct Write for Fan Out Packaging

Matthias Wahl¹, Steffen Diez¹, Christina Lopper², Markus Wöhrmann²

¹Heidelberg Instruments Mikrotechnik GmbH, Heidelberg, Germany; ²Fraunhofer IZM, Berlin, Germany