Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
AP5_Advances in WLP Technologies II
Time:
Thursday, 12/Sept/2024:
1:45pm - 3:15pm

Session Chair: Michael Schiffer, Fraunhofer IZM
Location: MOA 5

MOA 5

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Presentations
1:45pm - 2:10pm

Package Assembly Design Kits (PADK’s) – The Future of Advanced Wafer-level Manufacturing

Ruben Fuentes

Amkor Technology, United States of America



2:10pm - 2:35pm

Fan-out Packaging Reaching New Heights: Market and Technology Overview

Gabriela Pereira

Yole Group, Villeurbanne, France



2:35pm - 3:00pm

Optimizing Laser Direct Write for Fan Out Packaging

Matthias Wahl1, Steffen Diez1, Christina Lopper2, Markus Wöhrmann2

1Heidelberg Instruments Mikrotechnik GmbH, Heidelberg, Germany; 2Fraunhofer IZM, Berlin, Germany



 
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