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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AMT3_Process for Enhancement of Device Robustness

Time:

Thursday, 12/Sept/2024:

1:45pm - 3:15pm

Session Chair: David Henry, CEA LETI

Location: MOA 4

MOA 4

Presentations

1:45pm - 2:10pm

Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

University Liege, Liege, Belgium

2:10pm - 2:35pm

Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

Ming-Che Hsieh¹, Pu-Shan Huang², Chi-Yuan Chen², Stanley Lin², JoonYoung Choi³, WooSoon Kim³, YoungCheol Kim³

¹STATS ChipPAC Pte. Ltd., Singapore, Republic of Singapore; ²MediaTek, Inc.; ³STATS ChipPAC Korea Ltd.

2:35pm - 3:00pm

Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates

Hashem Al-Shami, Julian Schwietering, Henning Schröder

Fraunhofer IZM, Germany