Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
AMT3_Process for Enhancement of Device Robustness
Time:
Thursday, 12/Sept/2024:
1:45pm - 3:15pm

Session Chair: David Henry, CEA LETI
Location: MOA 4

MOA 4

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Presentations
1:45pm - 2:10pm

Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer

Serguei Stoukatch, Francois Dupont, Jean-Michel Redouté

University Liege, Liege, Belgium



2:10pm - 2:35pm

Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package

Ming-Che Hsieh1, Pu-Shan Huang2, Chi-Yuan Chen2, Stanley Lin2, JoonYoung Choi3, WooSoon Kim3, YoungCheol Kim3

1STATS ChipPAC Pte. Ltd., Singapore, Republic of Singapore; 2MediaTek, Inc.; 3STATS ChipPAC Korea Ltd.



2:35pm - 3:00pm

Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates

Hashem Al-Shami, Julian Schwietering, Henning Schröder

Fraunhofer IZM, Germany



 
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