Conference Time: 9th Nov 2024, 05:36:31pm CET
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AMT3_Process for Enhancement of Device Robustness
Time:
Thursday, 12/Sept/2024:
1:45pm - 3:15pm
Session Chair: David Henry , CEA LETI
Location: MOA 4 MOA 4
Presentations
1:45pm - 2:10pm Advanced Wafer Singulation Technique for Miniaturized Metal-oxide (MOX) Micro-hotplates Based Gas Analyzer
Serguei Stoukatch , Francois Dupont, Jean-Michel Redouté
University Liege, Liege, Belgium
2:10pm - 2:35pm Characterizations of Metal-based Thermal Interface Materials (TIM) in a Singulated Flip Chip Ball Grid Array Package
Ming-Che Hsieh 1 , Pu-Shan Huang2 , Chi-Yuan Chen2 , Stanley Lin2 , JoonYoung Choi3 , WooSoon Kim3 , YoungCheol Kim3
1 STATS ChipPAC Pte. Ltd., Singapore, Republic of Singapore; 2 MediaTek, Inc.; 3 STATS ChipPAC Korea Ltd.
2:35pm - 3:00pm Automated Highspeed Characterization of Optical Waveguide in large-format Glass Substrates
Hashem Al-Shami , Julian Schwietering, Henning Schröder
Fraunhofer IZM, Germany