Conference Agenda

11:00am - 11:25am

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using low-NA 300mm i-line Stepper

Lili Wang, Murat Pak, Nelson Pinho, John Slabbekoorn, Andy Miller, Eric Beyne

IMEC, Belgium

11:25am - 11:50am

Study of Cross-contamination in Multi-chamber PVD Systems used for High-throughput Seed Layer Deposition

Patrik Carazzetti¹, Carl Drechsel¹, Roland Rettenmeier¹, Jürgen Weichart¹, Kay Viehweger², Ewald Strolz¹

¹Evatec AG, Truebbach, Switzerland; ²Fraunhofer IZM-ASSID, Moritzburg, Germany

11:50am - 12:15pm

Enhanced Defect Detection with Deep Neural Networks Post Wafer Bonding

Fiete Stoll, Vikas Dubey, Dirk Wünsch, Frank Roscher, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany