JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@estc-conference.net.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AP4_Advances in WLP Technologies I

Time:

Thursday, 12/Sept/2024:

11:00am - 12:15pm

Session Chair: Rolf Aschenbrenner, Fraunhofer IZM

Location: MOA 5

MOA 5

Presentations

11:00am - 11:25am

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using low-NA 300mm i-line Stepper

Lili Wang, Murat Pak, Nelson Pinho, John Slabbekoorn, Andy Miller, Eric Beyne

IMEC, Belgium

11:25am - 11:50am

Study of Cross-contamination in Multi-chamber PVD Systems used for High-throughput Seed Layer Deposition

Patrik Carazzetti¹, Carl Drechsel¹, Roland Rettenmeier¹, Jürgen Weichart¹, Kay Viehweger², Ewald Strolz¹

¹Evatec AG, Truebbach, Switzerland; ²Fraunhofer IZM-ASSID, Moritzburg, Germany

11:50am - 12:15pm

Enhanced Defect Detection with Deep Neural Networks Post Wafer Bonding

Fiete Stoll, Vikas Dubey, Dirk Wünsch, Frank Roscher, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany