Conference Agenda

Session

Rel2_Package- and Board Level Moisture- and Thermal Stress-related Reliability Effects

Time:

Thursday, 12/Sept/2024:

11:00am - 12:15pm

Session Chair: Romuald Roucou, NXP

Location: MOA 1+2

MOA 1+2

Presentations

11:00am - 11:25am

Boundary Conditions for Reproducible and Comparable Condensation Tests to Prove the Migration Resistance of Assemblies

Bob Wittig¹, Adrian Kandziora¹, Gerret Asseburg², Markus Thoben²

¹Volkswagen AG, Germany; ²University of Applied Science and Arts, Dortmund Soest, Germany

11:25am - 11:50am

Analysis of LED Solder Joints During Combined Power and Thermal Cycling

Khalil Maarouf^1,2, Christine Roucoules¹, Helmut Klöcker², Sergio Sao-Joao²

¹Valeo Vision, France; ²Mines Saint-Etienne, Saint-Étienne, France

11:50am - 12:15pm

Analysis of Degradation Effects for Different Epoxy-based Molding Compounds (EMC) Under High Temperature Aging

Falk Naumann, Tino Stephan, Marcel Mittag, Robert Klengel, Sandy Klengel

Fraunhofer IMWS, Halle, Germany