11:00am - 11:25amAdvancements in Epoxy Pattern Quality Checks: Harnessing Artificial Intelligence for Enhanced Low-Contrast Analysis
Guodong Zeng, Farnaz Forooghifar, Andreas Wiedmer, Ernst Barmettler, Norbert Ackerl
Besi Switzerland AG, Steinhausen, Switzerland
11:25am - 11:50amDicing Lane Quality Quantification & Wafer Assessment Using Image Thresholding Techniques
Damien Jon Leech, Akito Hiro, Geert Schoofs, Bensu Tunca Altintas, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne
imec, Belgium
11:50am - 12:15pmAI Deep-Learning Approach for Manufacturing Optimization During Chiplets and Heterogeneous Package Inspection
Shahab Chitchian, SeungYeol Kim, TaeYoung Jung, TaeYong Lee, ByeongGweon Joo
INTEKPLUS Co., Daejeon, Korea, Republic of (South Korea)
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