Conference Agenda

9:15am - 9:40am

High Precision Direct Transfer Bonding for Submicron Die-to-wafer in 3D/Heterogeneous Integration

Ichiro Sano¹, Katsuya Yamada¹, Yuya Hirai¹, Masanori Yamagishi², Shinya Takyu², Yusuke Fumita², Yoichiro Kurita³

¹TAZMO CO.,LTD.; ²LINTEC Corporation; ³Tokyo Institute of Technology, Meguro City, Japan

9:40am - 10:05am

Bond Strength Measurement for Wafer-level and Chip-level Hybrid Bonding

Junya Fuse, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

Yokohama National University, Yokohama, Japan

10:05am - 10:30am

Optimization of Cu/SiCN Hybrid Bonding Process Using a Cohesive Zone Model

Dong Yan, Ali Roshanghias

Silicon Austria Labs GmbH, Heterogeneous Integration Technologies, Villach, Austria