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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AP3_Hybrid Bonding II

Time:

Thursday, 12/Sept/2024:

9:15am - 10:30am

Session Chair: Rolf Aschenbrenner, Fraunhofer IZM

Location: MOA 5

MOA 5

Presentations

9:15am - 9:40am

High Precision Direct Transfer Bonding for Submicron Die-to-wafer in 3D/Heterogeneous Integration

Ichiro Sano¹, Katsuya Yamada¹, Yuya Hirai¹, Masanori Yamagishi², Shinya Takyu², Yusuke Fumita², Yoichiro Kurita³

¹TAZMO CO.,LTD.; ²LINTEC Corporation; ³Tokyo Institute of Technology, Meguro City, Japan

9:40am - 10:05am

Bond Strength Measurement for Wafer-level and Chip-level Hybrid Bonding

Junya Fuse, Yuki Yoshihara, Marie Sano, Fumihiro Inoue

Yokohama National University, Yokohama, Japan

10:05am - 10:30am

Optimization of Cu/SiCN Hybrid Bonding Process Using a Cohesive Zone Model

Dong Yan, Ali Roshanghias

Silicon Austria Labs GmbH, Heterogeneous Integration Technologies, Villach, Austria