IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

JavaScript is Disabled
Your browser's JavaScript functionality is disabled. It has to be enabled to use this function of ConfTool.
Here you can find information on how to enable JavaScript
If you have any problems, please contact the organizers at office@estc-conference.net.

Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

Emerging I_From Mounting to Recycling – Highlites from Emerging Technologies

Time:

Thursday, 12/Sept/2024:

11:00am - 12:15pm

Session Chair: Martin Oppermann, TU Dresden

Location: MOA 10-12

MOA 10-12

Presentations

11:00am - 11:25am

Feasibility of Micro-grass on Silicon Cap as An Alternative Antireflective Layer in Vacuum Packaging of Microbolometer Arrays

Hoang-Vu Nguyen, Eivind Bardalen

University of South-Eastern Norway, Notodden, Norway

11:25am - 11:50am

Biodegradable PCBs with PLA/flax Substrate: FTIR and SEM Analysis of Degradation

Attila Géczy¹, Lívia Gyenizse¹, Csaba Farkas¹, Dániel Rigler¹, Balázs Sáfár¹, András Csiszár²

¹Budapest University of Technology and Economics, Budapest, Hungary; ²Meshlin Composites Zrt., Győr, Hungary,

11:50am - 12:15pm

A Novel Ultra-thin Dicing Die Attach Film for Various Dicing Processes

Masanori Yamagishi, Yutaro Ishii, Tomoka Kirihata, Manabu Miyawaki

LINTEC Corporation, Japan

Mobile View Print View

Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: IEEE ESTC 2024