Conference Agenda

Session

Rel1_Reliability Performance and Electromigration Behavior

Time:

Thursday, 12/Sept/2024:

9:15am - 10:30am

Session Chair: Matthias Heimann, Siemens AG

Location: MOA 1+2

MOA 1+2

Presentations

9:15am - 9:40am

Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary¹, Christian Grosse², Michael Kögel², Thilo Windemuth¹, Glenn Ross¹, Vesa Vuorinen¹, Sebastian Brand², Mervi Paulasto-Kröckel¹

¹Aalto University, Espoo, Finland; ²Fraunhofer IMWS, Halle, Germany

9:40am - 10:05am

Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-pitch Cu RDL

Adrija Chaudhuri¹, Johannes Jaeschke¹, Astrid Gollhardt¹, Hermann Oppermann¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany

10:05am - 10:30am

Investigation of the Influence of Shear Height in the Wire Bond Shear Test

Simon Kuttler¹, Olaf Wittler¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany