Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
Rel1_Reliability Performance and Electromigration Behavior
Time:
Thursday, 12/Sept/2024:
9:15am - 10:30am

Session Chair: Matthias Heimann, Siemens AG
Location: MOA 1+2

MOA 1+2

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Presentations
9:15am - 9:40am

Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration

Nikhilendu Tiwary1, Christian Grosse2, Michael Kögel2, Thilo Windemuth1, Glenn Ross1, Vesa Vuorinen1, Sebastian Brand2, Mervi Paulasto-Kröckel1

1Aalto University, Espoo, Finland; 2Fraunhofer IMWS, Halle, Germany



9:40am - 10:05am

Investigating the Failure Mechanisms of Electromigration and Copper Oxide Formation in Fine-pitch Cu RDL

Adrija Chaudhuri1, Johannes Jaeschke1, Astrid Gollhardt1, Hermann Oppermann1, Martin Schneider-Ramelow2

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany



10:05am - 10:30am

Investigation of the Influence of Shear Height in the Wire Bond Shear Test

Simon Kuttler1, Olaf Wittler1, Martin Schneider-Ramelow2

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany