Conference Agenda

9:15am - 9:40am

Reliability Testing and Virtual Prototyping for Embedded GaN Power Modules in Automotive Applications

Kshitij Anil Kolas¹, Alexander Otto¹, Maximilian Hepp², Rico Eichhorn¹, Jan Albrecht¹, Sven Rzepka¹

¹Fraunhofer ENAS, Chemnitz, Germany; ²Mercedes-Benz AG, Böblingen, Germany

9:40am - 10:05am

Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to improve SAC Solder Reliability Analysis

Mohd Zubair Akhtar, Christian Kreiner, Maximilian Schmid, Andreas Zippelius, Ulrich Tetzlaff, Gordon Elger

Technische Hochschule Ingolstadt, Ingolstadt, Germany

10:05am - 10:30am

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Chengdong Yuan^1,2, Sönke Maeter³, Youssef Maniar⁴, Tamara Bechtold^1,2

¹Jade University of Applied Sciences, Wilhelmshaven, Germany; ²University of Rostock, Rostock, Germany; ³Cadfem GmbH, Munich, Germany; ⁴Robert Bosch GmbH, Renningen, Germany