Conference Agenda

5:00pm - 5:25pm

Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel

University Grenoble Alpes CEA, LETI, Grenoble, France

5:25pm - 5:50pm

Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding

Pieter Bex¹, Mario Gonzalez¹, Steven Brems¹, Alain Phommahaxay¹, Koen D`Havé¹, Prathamesh Dhakras¹, Dieter H. Cuypers¹, Ye Lin¹, Eric Beyne¹, Jonathan Abdilla², Kawsar Ahmed Prince², Benedikt Auer², Djuro Bikaljevic², Manuel Deubler², Thiago Moura², Stefan Schmid², Pavel Seroglazov²

¹imec, Leuven, Belgium; ²BESI, Radfeld, Austria

5:50pm - 6:15pm

Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing

Soon Aik Chew¹, Joey Hung², Igor Turoves², Avron Ger², Mohamed Saib¹, Alain Moussa¹, Boyao Zhang¹, Joeri De Vos¹, Andy Miller¹, Anne-Laure Charley¹, Philippe Leray¹, Eric Beyne¹

¹imec, Loewen, Belgium; ²Nova Ltd., Rehovot, Israel