Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
AP2_Hybrid Bonding I
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm

Session Chair: E Jan Vardaman, TechSearch International, Inc.
 Location: MOA 5

MOA 5

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Presentations
5:00pm - 5:25pm

Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations

Margot Faure, Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel

University Grenoble Alpes CEA, LETI, Grenoble, France


5:25pm - 5:50pm

Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding

Pieter Bex1, Mario Gonzalez1, Steven Brems1, Alain Phommahaxay1, Koen D`Havé1, Prathamesh Dhakras1, Dieter H. Cuypers1, Ye Lin1, Eric Beyne1, Jonathan Abdilla2, Kawsar Ahmed Prince2, Benedikt Auer2, Djuro Bikaljevic2, Manuel Deubler2, Thiago Moura2, Stefan Schmid2, Pavel Seroglazov2

1imec, Leuven, Belgium; 2BESI, Radfeld, Austria


5:50pm - 6:15pm

Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing

Soon Aik Chew1, Joey Hung2, Igor Turoves2, Avron Ger2, Mohamed Saib1, Alain Moussa1, Boyao Zhang1, Joeri De Vos1, Andy Miller1, Anne-Laure Charley1, Philippe Leray1, Eric Beyne1

1imec, Loewen, Belgium; 2Nova Ltd., Rehovot, Israel