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AP2_Hybrid Bonding I
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm
Session Chair: E Jan Vardaman , TechSearch International, Inc.
Location: MOA 5 MOA 5
Presentations
5:00pm - 5:25pm Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
Margot Faure , Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sébastien Dominguez, Karine Abadie, Christophe Morales, Constantin Matei, Frank Fournel
University Grenoble Alpes CEA, LETI, Grenoble, France
5:25pm - 5:50pm Overlay Scaling Error Reduction for Hybrid Die-To-wafer Bonding
Pieter Bex 1 , Mario Gonzalez1 , Steven Brems1 , Alain Phommahaxay1 , Koen D`Havé1 , Prathamesh Dhakras1 , Dieter H. Cuypers1 , Ye Lin1 , Eric Beyne1 , Jonathan Abdilla2 , Kawsar Ahmed Prince2 , Benedikt Auer2 , Djuro Bikaljevic2 , Manuel Deubler2 , Thiago Moura2 , Stefan Schmid2 , Pavel Seroglazov2
1 imec, Leuven, Belgium; 2 BESI, Radfeld, Austria
5:50pm - 6:15pm Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing
Soon Aik Chew 1 , Joey Hung2 , Igor Turoves2 , Avron Ger2 , Mohamed Saib1 , Alain Moussa1 , Boyao Zhang1 , Joeri De Vos1 , Andy Miller1 , Anne-Laure Charley1 , Philippe Leray1 , Eric Beyne1
1 imec, Loewen, Belgium; 2 Nova Ltd., Rehovot, Israel