Conference Agenda

9:15am - 9:40am

Low Temperature Die-attach Bonding Using Copper Particle Free Inks

Fabian Steinberger¹, Nihesh Mohan¹, Olaf Rämer², Gordon Elger¹

¹Technische Hochschule Ingolstadt, Ingolstadt, Germany; ²TU Berlin, Berlin, Germany

9:40am - 10:05am

Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures

Lisette Hernandez Gonzalez, Knut E. Aasmundtveit, Hoang-Vu Nguyen

University of South-Eastern Norway, Norway

10:05am - 10:30am

Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures

GAYATHRY THAMPI, HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT

University of South-Eastern Norway, Norway