Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
MIP3_Low-temperature Materials for Interconnects and Packaging
Time:
Thursday, 12/Sept/2024:
9:15am - 10:30am

Session Chair: Hiroshi Nishikawa, Osaka University
 Location: MOA 10-12

MOA 10-12

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Presentations
9:15am - 9:40am

Low Temperature Die-attach Bonding Using Copper Particle Free Inks

Fabian Steinberger1, Nihesh Mohan1, Olaf Rämer2, Gordon Elger1

1Technische Hochschule Ingolstadt, Ingolstadt, Germany; 2TU Berlin, Berlin, Germany


9:40am - 10:05am

Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures

Lisette Hernandez Gonzalez, Knut E. Aasmundtveit, Hoang-Vu Nguyen

University of South-Eastern Norway, Norway


10:05am - 10:30am

Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures

GAYATHRY THAMPI, HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT

University of South-Eastern Norway, Norway