Conference Time: 23rd Nov 2024, 02:56:44pm CET
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
MIP3_Low-temperature Materials for Interconnects and Packaging
Time:
Thursday, 12/Sept/2024:
9:15am - 10:30am
Session Chair: Hiroshi Nishikawa , Osaka University
Location: MOA 10-12 MOA 10-12
Presentations
9:15am - 9:40am Low Temperature Die-attach Bonding Using Copper Particle Free Inks
Fabian Steinberger 1 , Nihesh Mohan1 , Olaf Rämer2 , Gordon Elger1
1 Technische Hochschule Ingolstadt, Ingolstadt, Germany; 2 TU Berlin, Berlin, Germany
9:40am - 10:05am Cu–(Sn–Bi) SLID Bond Microstructure Under Different Bonding Temperatures
Lisette Hernandez Gonzalez , Knut E. Aasmundtveit, Hoang-Vu Nguyen
University of South-Eastern Norway, Norway
10:05am - 10:30am Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures
GAYATHRY THAMPI , HOANG-VU NGUYEN, KNUT EILIF AASMUNDTVEIT
University of South-Eastern Norway, Norway
