Conference Agenda

Session
Keynote 3
Time:
Friday, 13/Sept/2024:
8:30am - 9:15am

 Location: MOA 10-12

MOA 10-12


"Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era"

Dr. Yasumitsu Orii
Senior Managing Executive Officer in 3D Assembly Division, Rapidus Corporation