Conference Agenda

Session
Power2_Power Semiconductor Packaging and Cooling
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm

Session Chair: Gudrun Feix, ECPE European Center for Power Electronics
Location: MOA 1+2

MOA 1+2

Presentations
5:00pm - 5:25pm

Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology

Kentaro Mori, Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro

Toshiba Electronic Devices & Storage Corporation, Japan



5:25pm - 5:50pm

Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology

Keita Suzuki1, Takumi Yumoto2, Koji Bando2, Tetsuo Endoh1, Yoshikazu Takahashi1

1Tohoku University, Tohoku, Japan; 2Shinko Electric Industries Co, LTD. Japan



5:50pm - 6:15pm

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Kaneeze Noorul Ain1,2, Guo Qi Zhang2, Augusto Rodrigues1, Md Nazmul Hasan1, Karen Geens3, Urmimala Chatterjee3, Ali Roshanghias1, Dominik Holzmann1

1Silicon Austria Labs (SAL), Villach, Austria; 2Delft University of Technology (TUD), Delft, The Netherlands; 3Interuniversity Microelectronics Centre (IMEC), Loewen, Belgium