Conference Agenda

5:00pm - 5:25pm

Model-based Development to Improve Electrical and Thermal Performances for Robust Si Power MOSFETs Using Embedded Die Packaging Technology

Kentaro Mori, Kohei Oasa, Hitoshi Imi, Yutaro Hayashi, Tatsuya Ohguro, Tatsuya Nishiwaki, Fumiyoshi Kawashiro

Toshiba Electronic Devices & Storage Corporation, Japan

5:25pm - 5:50pm

Research on Ultra-compact 3D SiC Power Module for EVs with Double Layer Cooling Technology

Keita Suzuki¹, Takumi Yumoto², Koji Bando², Tetsuo Endoh¹, Yoshikazu Takahashi¹

¹Tohoku University, Tohoku, Japan; ²Shinko Electric Industries Co, LTD. Japan

5:50pm - 6:15pm

An Introduction to Wire-bondless Discrete GaN Power Packages with Top-Side Cu Sinterconnects®

Kaneeze Noorul Ain^1,2, Guo Qi Zhang², Augusto Rodrigues¹, Md Nazmul Hasan¹, Karen Geens³, Urmimala Chatterjee³, Ali Roshanghias¹, Dominik Holzmann¹

¹Silicon Austria Labs (SAL), Villach, Austria; ²Delft University of Technology (TUD), Delft, The Netherlands; ³Interuniversity Microelectronics Centre (IMEC), Loewen, Belgium