Session | ||
DTM2_Reduced Order Modeling for Advanced Packaging
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Presentations | ||
5:00pm - 5:25pm
Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours 1School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.; 2School of Electrical, Computer and Energy Engineering, Arizona State University, Arizona, USA 5:25pm - 5:50pm
Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method 1CADFEM Germany GmbH, Germany; 2Fraunhofer ENAS, Chemnitz, Germany 5:50pm - 6:15pm
Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters 1Silicon Austria Labs GmbH, Austria; 2Ideas & Motion s.r.l., Cherasco, Italy |