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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

DTM2_Reduced Order Modeling for Advanced Packaging

Time:

Wednesday, 11/Sept/2024:

5:00pm - 6:15pm

Session Chair: Kshitij Anil Kolas, Fraunhofer ENAS

Location: MOA 3

MOA 3

Presentations

5:00pm - 5:25pm

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours

Sheikh Hassan¹, Stoyan Stoyanov¹, Pushparajah Rajaguru¹, Christopher Bailey²

¹School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.; ²School of Electrical, Computer and Energy Engineering, Arizona State University, Arizona, USA

5:25pm - 5:50pm

Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method

Mike Feuchter¹, Hanna Baumgartl¹, Martin Hanke¹, Sven Rzepka²

¹CADFEM Germany GmbH, Germany; ²Fraunhofer ENAS, Chemnitz, Germany

5:50pm - 6:15pm

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Abinash Pradhan¹, Giovanna Grosso¹, Varaha Satya Bharath Kurukuru¹, Claudio Romano², Roberto Petrella¹

¹Silicon Austria Labs GmbH, Austria; ²Ideas & Motion s.r.l., Cherasco, Italy