Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
DTM2_Reduced Order Modeling for Advanced Packaging
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm

Session Chair: Kshitij Anil Kolas, Fraunhofer ENAS
Location: MOA 3

MOA 3

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Presentations
5:00pm - 5:25pm

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessments of Power Electronic Modules with Nonlinear Material Behaviours

Sheikh Hassan1, Stoyan Stoyanov1, Pushparajah Rajaguru1, Christopher Bailey2

1School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom.; 2School of Electrical, Computer and Energy Engineering, Arizona State University, Arizona, USA



5:25pm - 5:50pm

Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behavior Applying the Energy Conserving Sampling and Weighting Method

Mike Feuchter1, Hanna Baumgartl1, Martin Hanke1, Sven Rzepka2

1CADFEM Germany GmbH, Germany; 2Fraunhofer ENAS, Chemnitz, Germany



5:50pm - 6:15pm

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Abinash Pradhan1, Giovanna Grosso1, Varaha Satya Bharath Kurukuru1, Claudio Romano2, Roberto Petrella1

1Silicon Austria Labs GmbH, Austria; 2Ideas & Motion s.r.l., Cherasco, Italy



 
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