Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
Opto2_Heterogenous PIC Integration
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm

Session Chair: Giovanni Delrosso, VTT
 Location: MOA 4

MOA 4

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Presentations
5:00pm - 5:25pm

Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Tampere University, Tampere, Finland


5:25pm - 5:50pm

Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure

Taichi Misawa1, Hiroshi Uemura1, Keiji Tanaka1, Katsumi Uesaka1, Yoichiro Kurita2

1Sumitomo Electric Industries, Ltd., Yokohama, Japan; 2Tokyo Institute of Technology, Tokyo, Japan


5:50pm - 6:15pm

Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications

Johanna Rimboeck1, Stefan Ertl1, Prasanna Ramaswamy2, Alex Farrell2, Ali Uzun5, Mariana Pires1, Brian Corbett3, Ruggero Loi2, Ksenija Varga1, Peter Ossieur4

1EV Group, Florian am Inn, Austria; 2X-Celeprint Limited, Cork, Ireland; 3Tyndall National Institute, Cork, Ireland; 4IDLab, INTEC, Ghent University - imec, Ghent, Belgium; 5Photonics Research Group, INTEC, Ghent University - imec, Ghent, Belgium