Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Opto2_Heterogenous PIC Integration
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm
Session Chair: Giovanni Delrosso , VTT
Location: MOA 4 MOA 4
Presentations
5:00pm - 5:25pm Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment
Aleksandr Vlasov , Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina
Tampere University, Tampere, Finland
5:25pm - 5:50pm Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure
Taichi Misawa 1 , Hiroshi Uemura1 , Keiji Tanaka1 , Katsumi Uesaka1 , Yoichiro Kurita2
1 Sumitomo Electric Industries, Ltd., Yokohama, Japan; 2 Tokyo Institute of Technology, Tokyo, Japan
5:50pm - 6:15pm Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications
Johanna Rimboeck1 , Stefan Ertl1 , Prasanna Ramaswamy2 , Alex Farrell2 , Ali Uzun5 , Mariana Pires1 , Brian Corbett3 , Ruggero Loi2 , Ksenija Varga 1 , Peter Ossieur4
1 EV Group, Florian am Inn, Austria; 2 X-Celeprint Limited, Cork, Ireland; 3 Tyndall National Institute, Cork, Ireland; 4 IDLab, INTEC, Ghent University - imec, Ghent, Belgium; 5 Photonics Research Group, INTEC, Ghent University - imec, Ghent, Belgium