Laser-Assisted Bonding of a Miniature Multichannel Laser Diode Chip to a Silicon Photonics Integrated Circuit with Through-Silicon Alignment

Aleksandr Vlasov, Santeri Lehtinen, Evgenii Lepukhov, Heikki Virtanen, Samu-Pekka Ojanen, Jukka Viheriälä, Mircea Guina

Tampere University, Tampere, Finland

Over 100-GHz Bridge Chip Interconnection Between Photonic and Electrical ICs with a Heat-insulating Stress-relief Membrane Structure

Taichi Misawa¹, Hiroshi Uemura¹, Keiji Tanaka¹, Katsumi Uesaka¹, Yoichiro Kurita²

¹Sumitomo Electric Industries, Ltd., Yokohama, Japan; ²Tokyo Institute of Technology, Tokyo, Japan

Advanced Ultrathin Spray Coating Process Technology for Heterogeneous Integration Applications

Johanna Rimboeck¹, Stefan Ertl¹, Prasanna Ramaswamy², Alex Farrell², Ali Uzun⁵, Mariana Pires¹, Brian Corbett³, Ruggero Loi², Ksenija Varga¹, Peter Ossieur⁴

¹EV Group, Florian am Inn, Austria; ²X-Celeprint Limited, Cork, Ireland; ³Tyndall National Institute, Cork, Ireland; ⁴IDLab, INTEC, Ghent University - imec, Ghent, Belgium; ⁵Photonics Research Group, INTEC, Ghent University - imec, Ghent, Belgium