Conference Agenda

2:40pm - 3:05pm

Development of Packaging Technology for 2.xD Advanced Packages; Fine Bump Interconnection, Fine Cu Wiring and Large Package

Kei Togasaki, Masashi Minami, Dongchul Kang, Sadaaki Katoh

Resonac Corporation, Japan

3:05pm - 3:30pm

Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates

Richard Noack, Nils Anspach, Roman Ostholt, Daniel Dunker, Norbert Ambrosius

LPKF Laser & Electronics SE, Garbsen, Germany

3:30pm - 3:55pm

High Rate and Selective (Deep) Reactive-ion Etching Process for the Formation of High-density Vertical Interconnects into Dielectric Build-up Films

Ioannis Tsigaras¹, Ioannis Alexiou¹, Christian Voigt², Lars Böttcher³, Ewald Strolz¹, Roland Rettenmeier¹

¹Evatec AG, Trübbach, Switzerland; ²TU Berlin, Berlin, Germany; ³Fraunhofer IZM, Berlin, Germany