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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AP1_Advanced Substrates

Time:

Wednesday, 11/Sept/2024:

2:40pm - 3:55pm

Session Chair: Andreas Ostmann, IZM

Location: MOA 5

MOA 5

Presentations

2:40pm - 3:05pm

Development of Packaging Technology for 2.xD Advanced Packages; Fine Bump Interconnection, Fine Cu Wiring and Large Package

Kei Togasaki, Masashi Minami, Dongchul Kang, Sadaaki Katoh

Resonac Corporation, Japan

3:05pm - 3:30pm

Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates

Richard Noack, Nils Anspach, Roman Ostholt, Daniel Dunker, Norbert Ambrosius

LPKF Laser & Electronics SE, Garbsen, Germany

3:30pm - 3:55pm

High Rate and Selective (Deep) Reactive-ion Etching Process for the Formation of High-density Vertical Interconnects into Dielectric Build-up Films

Ioannis Tsigaras¹, Ioannis Alexiou¹, Christian Voigt², Lars Böttcher³, Ewald Strolz¹, Roland Rettenmeier¹

¹Evatec AG, Trübbach, Switzerland; ²TU Berlin, Berlin, Germany; ³Fraunhofer IZM, Berlin, Germany