Conference Time: 23rd Nov 2024, 06:55:30pm CET
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AP1_Advanced Substrates
Time:
Wednesday, 11/Sept/2024:
2:40pm - 3:55pm
Session Chair: Andreas Ostmann , IZM
Location: MOA 5 MOA 5
Presentations
2:40pm - 3:05pm Development of Packaging Technology for 2.xD Advanced Packages; Fine Bump Interconnection, Fine Cu Wiring and Large Package
Kei Togasaki , Masashi Minami, Dongchul Kang, Sadaaki Katoh
Resonac Corporation, Japan
3:05pm - 3:30pm Advancing Chiplet Architecture Through Heterogeneous Integration on Laser-processed Glass Substrates
Richard Noack , Nils Anspach, Roman Ostholt, Daniel Dunker, Norbert Ambrosius
LPKF Laser & Electronics SE, Garbsen, Germany
3:30pm - 3:55pm High Rate and Selective (Deep) Reactive-ion Etching Process for the Formation of High-density Vertical Interconnects into Dielectric Build-up Films
Ioannis Tsigaras 1 , Ioannis Alexiou1 , Christian Voigt2 , Lars Böttcher3 , Ewald Strolz1 , Roland Rettenmeier1
1 Evatec AG, Trübbach, Switzerland; 2 TU Berlin, Berlin, Germany; 3 Fraunhofer IZM, Berlin, Germany
