Conference Agenda

5:00pm - 5:25pm

Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications

Sarabjot Singh, Kathleen Dunn

University at Albany, State University of New York, New York, USA

5:25pm - 5:50pm

Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization

Imants Cirulis, Vikas Dubey, Silvia Braun, Dirk Wünsch, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany

5:50pm - 6:15pm

Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect

Tadatomo Suga¹, Kanji Otsuka¹, Junsha Wang^1,2

¹Meisei University, Hino, Japan; ²The University of Tokyo Tokyo, Japan