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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

MIP2_Advanced Interconnection Metallurgical Materials and Interconnects

Time:

Wednesday, 11/Sept/2024:

5:00pm - 6:15pm

Session Chair: Ali Roshanghias, Silicon Austria Labs GmbH

Location: MOA 10-12

MOA 10-12

Presentations

5:00pm - 5:25pm

Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications

Sarabjot Singh, Kathleen Dunn

University at Albany, State University of New York, New York, USA

5:25pm - 5:50pm

Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization

Imants Cirulis, Vikas Dubey, Silvia Braun, Dirk Wünsch, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany

5:50pm - 6:15pm

Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect

Tadatomo Suga¹, Kanji Otsuka¹, Junsha Wang^1,2

¹Meisei University, Hino, Japan; ²The University of Tokyo Tokyo, Japan