Conference Time: 23rd Nov 2024, 12:53:03pm CET
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
MIP2_Advanced Interconnection Metallurgical Materials and Interconnects
Time:
Wednesday, 11/Sept/2024:
5:00pm - 6:15pm
Session Chair: Ali Roshanghias , Silicon Austria Labs GmbH
Location: MOA 10-12 MOA 10-12
Presentations
5:00pm - 5:25pm Tuning of Copper Grain Size for Integration in Hybrid Bonding Applications
Sarabjot Singh , Kathleen Dunn
University at Albany, State University of New York, New York, USA
5:25pm - 5:50pm Fine Pitch Aluminum Hybrid Bonding at Wafer Level: Overcoming the Challenges in Plating, Passivation and Planarization
Imants Cirulis, Vikas Dubey , Silvia Braun, Dirk Wünsch, Maik Wiemer
Fraunhofer ENAS, Chemnitz, Germany
5:50pm - 6:15pm Surface Activated Bonding for Hybrid and All-metal 3D (AM3D) Interconnect
Tadatomo Suga 1 , Kanji Otsuka1 , Junsha Wang1,2
1 Meisei University, Hino, Japan; 2 The University of Tokyo Tokyo, Japan
