Conference Agenda

Session

Power1_Electronics Measurement and Simulation

Time:

Wednesday, 11/Sept/2024:

2:40pm - 3:55pm

Session Chair: Aurelian Kotlar, Eberspächer

Location: MOA 1+2

MOA 1+2

Presentations

2:40pm - 3:05pm

Dynamic Calibration of Junction Temperature of SiC MOSFETs for Power Cycling

Jakob Breuer¹, Fabian Dresel¹, Andreas Schletz², Juergen Leib¹, Bernd Eckardt¹, Martin Maerz³

¹Fraunhofer IISB, Erlangen, Germany; ²SCHLETZ GmbH, Amberg, Germany; ³Friedrich-Alexander-University of Erlangen-Nürnberg, Erlangen, Germany

3:05pm - 3:30pm

Contact Thermography – New Findings, New Ideas

Martin Oppermann, Lea Borngräber, Oliver Albrecht, Thomas Zerna

TU Dresden, Dresden, Germany

3:30pm - 3:55pm

Abrasion Characterization of Graphene-enhanced Thermal Interface Materials for Electronics Thermal Management Applications

Kristoffer Harr¹, Yuanyuan Wang¹, Johan Möller¹, Johan Liu²

¹Smart High Tech AB, Goeteborg, Sweden; ²Chalmers University of Technology, Goeteborg, Sweden