Conference Agenda

2:40pm - 3:05pm

Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms

Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne

imec, Loewen, Belgium

3:05pm - 3:30pm

Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning

Weiyang Miao^1,2, Chuan Seng Tan^1,2, Mihai Dragos Rotaru¹

¹Institute of Microelectronics (IME), Singapore, Republic of Singapore; ²School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Republic of Singapore

3:30pm - 3:55pm

Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects

Yudong Yang^1,2, Fengze Hou¹, Chi Zhang^2,4, Rui Ma¹, Shangyang Shi², Fei Ding¹, Yu Zhang¹, Renxi Jin¹, Qidong Wang¹, Wei Wang^2,3,4

¹Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic of; ²School of Integrated Circuits, Peking University, Beijing, China, People's Republic of; ³Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China, People's Republic of; ⁴National Key Lab of Micro/Nano Fabrication Technology, China, People's Republic of