Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
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Session Overview
Session
DTM1_Co-design and Modeling for Chiplets
Time:
Wednesday, 11/Sept/2024:
2:40pm - 3:55pm

Session Chair: Chris Bailey, Arizona State University
 Location: MOA 3

MOA 3

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Presentations
2:40pm - 3:05pm

Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms

Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne

imec, Loewen, Belgium


3:05pm - 3:30pm

Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning

Weiyang Miao1,2, Chuan Seng Tan1,2, Mihai Dragos Rotaru1

1Institute of Microelectronics (IME), Singapore, Republic of Singapore; 2School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Republic of Singapore


3:30pm - 3:55pm

Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects

Yudong Yang1,2, Fengze Hou1, Chi Zhang2,4, Rui Ma1, Shangyang Shi2, Fei Ding1, Yu Zhang1, Renxi Jin1, Qidong Wang1, Wei Wang2,3,4

1Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic of; 2School of Integrated Circuits, Peking University, Beijing, China, People's Republic of; 3Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China, People's Republic of; 4National Key Lab of Micro/Nano Fabrication Technology, China, People's Republic of