Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
Session Chair: Chris Bailey, Arizona State University
Location:MOA 3
MOA 3
Presentations
2:40pm - 3:05pm
Simulations of Wafer-to-wafer Bonding Dynamics and Deformation Mechanisms
Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Mario Gonzalez, Eric Beyne
imec, Loewen, Belgium
3:05pm - 3:30pm
Signal Integrity Optimization for CoWoS Chiplet Interconnection Design Assisted by Reinforcement Learning
Weiyang Miao1,2, Chuan Seng Tan1,2, Mihai Dragos Rotaru1
1Institute of Microelectronics (IME), Singapore, Republic of Singapore; 2School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Republic of Singapore
3:30pm - 3:55pm
Finite Element Analysis of Stress Variation of Hybrid Bonding During Miniaturization of Interconnects
1Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic of; 2School of Integrated Circuits, Peking University, Beijing, China, People's Republic of; 3Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China, People's Republic of; 4National Key Lab of Micro/Nano Fabrication Technology, China, People's Republic of
