Conference Agenda

Session
Opto1_Photonic Module Packaging
Time:
Wednesday, 11/Sept/2024:
2:40pm - 3:55pm

Session Chair: Henning Schröder, Fraunhofer IZM
Location: MOA 4

MOA 4

Presentations
2:40pm - 3:05pm

Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules

Ulli Hansen, Xiaodong Hu, Simon Maus, Oliver Gyenge

MSG Lithoglas GmbH, Germany



3:05pm - 3:30pm

Modular Integration of Quantum Cascade Lasers and Drivers in Glass Bench

Gunnar Böttger1, Michael Häußler2, Lasse Felix Weißenburg1, Martin Hempel1, Ralf Ziegler2, Martin Schneider-Ramelow1

1Fraunhofer IZM, Berlin, Germany; 2Laser Electronics LE GmbH, Berlin, Germany



3:30pm - 3:55pm

Improving the Thermal Management of Power LED Arrays with Diamonds

Shusmitha Kyatam, Antonio A. Marques, Luis Rodrigues, Luis Nero Alves, Joana Catarina Mendes

Instituto de Telecomunicacoes, Portugal