Session | ||
Opto1_Photonic Module Packaging
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Presentations | ||
2:40pm - 3:05pm
Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules MSG Lithoglas GmbH, Germany 3:05pm - 3:30pm
Modular Integration of Quantum Cascade Lasers and Drivers in Glass Bench 1Fraunhofer IZM, Berlin, Germany; 2Laser Electronics LE GmbH, Berlin, Germany 3:30pm - 3:55pm
Improving the Thermal Management of Power LED Arrays with Diamonds Instituto de Telecomunicacoes, Portugal |