Conference Agenda

Session
AP6_Challenges and Solutions for HI
Time:
Thursday, 12/Sept/2024:
3:45pm - 5:15pm

Session Chair: Kay Essig, ASE Group
Location: MOA 5

MOA 5

Presentations
3:45pm - 4:10pm

Acoustic MEMS Packaging for Audio Micro-System Applications

Luca Maggi, Fabrizio Cerini, Silvia Adorno, Amedeo Maierna, Marco Del Sarto, Alex Gritti, Andrea Ratti, Nazariy Nashkolnyy

STMicroelectronics, Italy



4:10pm - 4:35pm

IMC Assisted Die-bonding for Stacked Device Integration

Masataka Maehara1, Jaber Derakhshandeh2, Carine Gerets2, Tom Cochet2, Dieter H Cuypers2, Andy Miller2, Gerald Beyer2, Geert Van der Plas2, Eric Beyne2

1Sony Semiconductor Solutions Corporation, Atsugi, Kanagawa, Japan; 2IMEC, Leuven, Belgium



4:35pm - 5:00pm

High-throughput In-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Bensu Tunca Altintas1, Mohamed Saib1, Alain Moussa1, Soon Aik Chew1, Boyao Zhang1, Joeri De Vos1, Andy Miller1, Eric Beyne1, Gian Lorusso1, Anne-Laure Charley1, Janusz Bogdanowicz1, Hiroaki Kasai2, Kazuhisa Hasumi2, Nobuyuki Mise3, Mayuka Osaki4, Maki Tanaka2

1imec, Leuven, Belgium; 2Hitachi High-Tech Corporation Ibaraki, Ibraki, Japan; 3Hitachi High-Tech Corporation Tokyo, Tokyo, Japan; 4Hitachi, Ltd. Kanagawa, Kanagawa, Japan