Conference Agenda

3:45pm - 4:10pm

Acoustic MEMS Packaging for Audio Micro-System Applications

Luca Maggi, Fabrizio Cerini, Silvia Adorno, Amedeo Maierna, Marco Del Sarto, Alex Gritti, Andrea Ratti, Nazariy Nashkolnyy

STMicroelectronics, Italy

4:10pm - 4:35pm

IMC Assisted Die-bonding for Stacked Device Integration

Masataka Maehara¹, Jaber Derakhshandeh², Carine Gerets², Tom Cochet², Dieter H Cuypers², Andy Miller², Gerald Beyer², Geert Van der Plas², Eric Beyne²

¹Sony Semiconductor Solutions Corporation, Atsugi, Kanagawa, Japan; ²IMEC, Leuven, Belgium

4:35pm - 5:00pm

High-throughput In-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Bensu Tunca Altintas¹, Mohamed Saib¹, Alain Moussa¹, Soon Aik Chew¹, Boyao Zhang¹, Joeri De Vos¹, Andy Miller¹, Eric Beyne¹, Gian Lorusso¹, Anne-Laure Charley¹, Janusz Bogdanowicz¹, Hiroaki Kasai², Kazuhisa Hasumi², Nobuyuki Mise³, Mayuka Osaki⁴, Maki Tanaka²

¹imec, Leuven, Belgium; ²Hitachi High-Tech Corporation Ibaraki, Ibraki, Japan; ³Hitachi High-Tech Corporation Tokyo, Tokyo, Japan; ⁴Hitachi, Ltd. Kanagawa, Kanagawa, Japan