IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

AP6_Challenges and Solutions for HI

Time:

Thursday, 12/Sept/2024:

3:45pm - 5:15pm

Session Chair: Kay Essig, ASE Group

Location: MOA 5

MOA 5

Presentations

3:45pm - 4:10pm

Acoustic MEMS Packaging for Audio Micro-System Applications

Luca Maggi, Fabrizio Cerini, Silvia Adorno, Amedeo Maierna, Marco Del Sarto, Alex Gritti, Andrea Ratti, Nazariy Nashkolnyy

STMicroelectronics, Italy

4:10pm - 4:35pm

IMC Assisted Die-bonding for Stacked Device Integration

Masataka Maehara¹, Jaber Derakhshandeh², Carine Gerets², Tom Cochet², Dieter H Cuypers², Andy Miller², Gerald Beyer², Geert Van der Plas², Eric Beyne²

¹Sony Semiconductor Solutions Corporation, Atsugi, Kanagawa, Japan; ²IMEC, Leuven, Belgium

4:35pm - 5:00pm

High-throughput In-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Bensu Tunca Altintas¹, Mohamed Saib¹, Alain Moussa¹, Soon Aik Chew¹, Boyao Zhang¹, Joeri De Vos¹, Andy Miller¹, Eric Beyne¹, Gian Lorusso¹, Anne-Laure Charley¹, Janusz Bogdanowicz¹, Hiroaki Kasai², Kazuhisa Hasumi², Nobuyuki Mise³, Mayuka Osaki⁴, Maki Tanaka²

¹imec, Leuven, Belgium; ²Hitachi High-Tech Corporation Ibaraki, Ibraki, Japan; ³Hitachi High-Tech Corporation Tokyo, Tokyo, Japan; ⁴Hitachi, Ltd. Kanagawa, Kanagawa, Japan

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