Conference Time: 19th Sept 2024, 07:10:40pm CEST
Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).
MIP1_Advanced Material Architectures for Interconnects
Time:
Wednesday, 11/Sept/2024:
2:40pm - 3:55pm
Session Chair: Glenn Hamilton Ross , Aalto University
Location: MOA 10-12 MOA 10-12
Presentations
2:40pm - 3:05pm Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems
Steffen Bickel 1,2 , Juliana Panchenko1,2 , Manuela Junghähnel1
1 Fraunhofer IZM-ASSID, Moritzburg, Germany; 2 TU Dresden, Dresden, Germany
3:05pm - 3:30pm Superconducting Superlattice Interconnects for Cryogenic Systems
Charles Bon-mardion 1 , Edouard Deschaseaux1 , Thierry Farjot1 , Alain Campo1 , Frédéric Ritton1 , Rémi Vélard1 , Hélène Duchemin1 , Céline Feautrier1 , Jean-Luc Sauvageot2 , Jean Charbonnier1 , Candice Thomas1
1 Univ. Grenoble Alpes, CEA, LETI, Grenoble, France; 2 Université Paris-Saclay, CEA, IRFU, Gif-sur-Yvette, France
3:30pm - 3:55pm Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames
Silvia Braun, Imants Cirulis , Klaus Vogel, Christian Hofmann, Maik Wiemer
Fraunhofer ENAS, Chemnitz, Germany
