IEEE ESTC 2024

September 11–13, 2024 | Berlin, Germany

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Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Session Overview

Session

MIP1_Advanced Material Architectures for Interconnects

Time:

Wednesday, 11/Sept/2024:

2:40pm - 3:55pm

Session Chair: Glenn Hamilton Ross, Aalto University

Location: MOA 10-12

MOA 10-12

Presentations

2:40pm - 3:05pm

Solid-state Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems

Steffen Bickel^1,2, Juliana Panchenko^1,2, Manuela Junghähnel¹

¹Fraunhofer IZM-ASSID, Moritzburg, Germany; ²TU Dresden, Dresden, Germany

3:05pm - 3:30pm

Superconducting Superlattice Interconnects for Cryogenic Systems

Charles Bon-mardion¹, Edouard Deschaseaux¹, Thierry Farjot¹, Alain Campo¹, Frédéric Ritton¹, Rémi Vélard¹, Hélène Duchemin¹, Céline Feautrier¹, Jean-Luc Sauvageot², Jean Charbonnier¹, Candice Thomas¹

¹Univ. Grenoble Alpes, CEA, LETI, Grenoble, France; ²Université Paris-Saclay, CEA, IRFU, Gif-sur-Yvette, France

3:30pm - 3:55pm

Aluminium-Aluminium Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminium Bonding Frames

Silvia Braun, Imants Cirulis, Klaus Vogel, Christian Hofmann, Maik Wiemer

Fraunhofer ENAS, Chemnitz, Germany

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