Conference Agenda

An Overview of the Thick Film Copper Technology for Power Electronics

Jiri Hlina¹, Jan Reboun¹, Lukas Stepan², Marek Simonovsky²

¹University of West Bohemia, Faculty of Electrical Engineering, Prague, Czech Republic; ²Elceram a.s., Hradec Kralove, Czech Republic

Monitoring Cu via Structures and Surrounding Dielectric Stack After CMP Process

Peter Basa, Attila Suto, Gyorgy Nadudvari, Silvia Poppa

Semilab Semiconductor Physics Laboratory Co. Ltd., Budapest, Hungary

Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates

Adam Yuile¹, Nesrine Jaziri², Erik Wiss¹, Jens Müller², Steffen Wiese¹

¹Saarland University, Saarbrücken, Germany; ²TU Ilmenau, Ilmenau, Germany

Modelling the Influence of Stretched Molding Foil on the Overall Dimensions of Molded Packages.

Jurrian Zijl¹, Edwin Lamers², Thijs Besseling³, Niels Nijenmanting²

¹BESI Netherlands B.V., The Netherlands; ²Reden B.V. , The Netherlands; ³IMEC at Holst Centre., The Netherlands

Mitigating Gas-induced Performance Degradation in High Reliability Electronic and Optoelectronic Systems

Alessio Corazza, Giovanni Zafarana, Enea Rizzi, Luca Mauri

SAES Getters, Lainate, Italy

Ag and SiO2 Mixed Powder Sintering System

Minoru Ueshima

Daicel corporation, Japan

Investigation of Side Wall Loss for Development of 6 µm Microbumps for 3D/2.5D Integration

Adil Shehzad¹, Maksym Myndyk¹, Manuela Junghähnel¹, Juliana Panchenko^1,2

¹Fraunhofer IZM-ASSID, Moritzburg, Germany; ²TU Dresden, Dresden, Germany

Improving The Thinning Module Robustness Vis-a-vis the Bonding Misalignment & the TBM EBR

NADER JEDIDI, Koen Kennes, ALain Phommahaxay

IMEC, Loewen, Belgium

LidroCUT - Laser Processing in Liquids for New Packaging Applications

Alexander Kanitz, Jan-Philipp Wessels, Jan Stefan Hoppius, Katharina Laake

Lidrotec GmbH, Bochum, Germany

Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications

Nyake Gahein-Sama¹, Marc Dreissigacker², Friedrich Müller², Christian Tschoban¹, Tanja Braun¹, Karl-Friedrich Becker¹, Martin Schneider-Ramelow²

¹Fraunhofer IZM, Berlin, Germany; ²TU Berlin, Berlin, Germany

Use of 3D Printing Techniques in the Development of Electronic Systems, Support Stage in the Digital Transformation of the Laboratories

Miruna-Lucretia Comeaga, Madalin Vasile Moise, Octavian Dontu, Dan Andrei Luca

National University of Science and Technology POLITEHNICA Bucharest, Bucharest,Romania

Evolved Finite Difference Model to Investigate Humidity-related Failure Modes for Microelectronic and Power Electronic Devices

Alexander Reichel, Falk Naumann, Marco Rudolph, Marcel Mittag, Sandy Klengel

Fraunhofer IMWS, Halle, Germany

Study of the Water and Steam Resistance of Thick Film Materials for Sensor Applications up to 300 °C

Maik Mueller¹, Sergey Saakyan¹, Marco Luniak¹, Heiko Pietruske², Eckhard Schleicher², Juliana Panchenko^1,3

¹TU Dresden, Dresden, Germany; ²Helmholtz-Zentrum Dresden-Rossendorf, Dresden, Germany; ³Fraunhofer IZM-ASSID, Moritzburg, Germany

Tape Automated Bonding of an ALPIDE Chip with Flexible PCB

David Novel¹, Alessandro Lega^1,2, Tiziano Facchinelli¹, Roberto Iuppa², Stefania Beolé³, Pierluigi Bellutti^1,4

¹Fondazione Bruno Kessler, Italy; ²University of Trento/ INFN TIFPA, Italy; ³University of Turin/ INFN Turin, Italy; ⁴INAF, Italy

Direct Flip Chip Bonding on Laser Induced Graphene Structures for Low-cost Flexible Sensor Devices

Muhammad Hassan Malik¹, Lukas Neumaier¹, Fabiane Fantinelli Franco², Ali Roshanghias¹

¹Silicon Austria Labs, Austria; ²University of Glasgow, Glasgow, United Kingdom

Reliable Fabrication Methodology for Consistent Supercapacitor Performance

Irina Madalina Burcea, Rodica Cristina Negroiu, Bogdan Traian Mihailescu, Vasile Madalin Moise, Cristina Marghescu, Paul Svasta

POLITEHNICA București National University for Science and Technology, Bukarest, Romania