Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
Poster Session 3
Time:
Friday, 13/Sept/2024:
10:30am - 11:45am

Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
Location: Atrium

Exhibition

Show help for 'Increase or decrease the abstract text size'
Presentations

An Overview of the Thick Film Copper Technology for Power Electronics

Jiri Hlina1, Jan Reboun1, Lukas Stepan2, Marek Simonovsky2

1University of West Bohemia, Faculty of Electrical Engineering, Prague, Czech Republic; 2Elceram a.s., Hradec Kralove, Czech Republic



Monitoring Cu via Structures and Surrounding Dielectric Stack After CMP Process

Peter Basa, Attila Suto, Gyorgy Nadudvari, Silvia Poppa

Semilab Semiconductor Physics Laboratory Co. Ltd., Budapest, Hungary



Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates

Adam Yuile1, Nesrine Jaziri2, Erik Wiss1, Jens Müller2, Steffen Wiese1

1Saarland University, Saarbrücken, Germany; 2TU Ilmenau, Ilmenau, Germany



Modelling the Influence of Stretched Molding Foil on the Overall Dimensions of Molded Packages.

Jurrian Zijl1, Edwin Lamers2, Thijs Besseling3, Niels Nijenmanting2

1BESI Netherlands B.V., The Netherlands; 2Reden B.V. , The Netherlands; 3IMEC at Holst Centre., The Netherlands



Mitigating Gas-induced Performance Degradation in High Reliability Electronic and Optoelectronic Systems

Alessio Corazza, Giovanni Zafarana, Enea Rizzi, Luca Mauri

SAES Getters, Lainate, Italy



Ag and SiO2 Mixed Powder Sintering System

Minoru Ueshima

Daicel corporation, Japan



Investigation of Side Wall Loss for Development of 6 µm Microbumps for 3D/2.5D Integration

Adil Shehzad1, Maksym Myndyk1, Manuela Junghähnel1, Juliana Panchenko1,2

1Fraunhofer IZM-ASSID, Moritzburg, Germany; 2TU Dresden, Dresden, Germany



Improving The Thinning Module Robustness Vis-a-vis the Bonding Misalignment & the TBM EBR

NADER JEDIDI, Koen Kennes, ALain Phommahaxay

IMEC, Loewen, Belgium



LidroCUT - Laser Processing in Liquids for New Packaging Applications

Alexander Kanitz, Jan-Philipp Wessels, Jan Stefan Hoppius, Katharina Laake

Lidrotec GmbH, Bochum, Germany



Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications

Nyake Gahein-Sama1, Marc Dreissigacker2, Friedrich Müller2, Christian Tschoban1, Tanja Braun1, Karl-Friedrich Becker1, Martin Schneider-Ramelow2

1Fraunhofer IZM, Berlin, Germany; 2TU Berlin, Berlin, Germany



Use of 3D Printing Techniques in the Development of Electronic Systems, Support Stage in the Digital Transformation of the Laboratories

Miruna-Lucretia Comeaga, Madalin Vasile Moise, Octavian Dontu, Dan Andrei Luca

National University of Science and Technology POLITEHNICA Bucharest, Bucharest,Romania



Evolved Finite Difference Model to Investigate Humidity-related Failure Modes for Microelectronic and Power Electronic Devices

Alexander Reichel, Falk Naumann, Marco Rudolph, Marcel Mittag, Sandy Klengel

Fraunhofer IMWS, Halle, Germany



Study of the Water and Steam Resistance of Thick Film Materials for Sensor Applications up to 300 °C

Maik Mueller1, Sergey Saakyan1, Marco Luniak1, Heiko Pietruske2, Eckhard Schleicher2, Juliana Panchenko1,3

1TU Dresden, Dresden, Germany; 2Helmholtz-Zentrum Dresden-Rossendorf, Dresden, Germany; 3Fraunhofer IZM-ASSID, Moritzburg, Germany



Tape Automated Bonding of an ALPIDE Chip with Flexible PCB

David Novel1, Alessandro Lega1,2, Tiziano Facchinelli1, Roberto Iuppa2, Stefania Beolé3, Pierluigi Bellutti1,4

1Fondazione Bruno Kessler, Italy; 2University of Trento/ INFN TIFPA, Italy; 3University of Turin/ INFN Turin, Italy; 4INAF, Italy



Direct Flip Chip Bonding on Laser Induced Graphene Structures for Low-cost Flexible Sensor Devices

Muhammad Hassan Malik1, Lukas Neumaier1, Fabiane Fantinelli Franco2, Ali Roshanghias1

1Silicon Austria Labs, Austria; 2University of Glasgow, Glasgow, United Kingdom



Reliable Fabrication Methodology for Consistent Supercapacitor Performance

Irina Madalina Burcea, Rodica Cristina Negroiu, Bogdan Traian Mihailescu, Vasile Madalin Moise, Cristina Marghescu, Paul Svasta

POLITEHNICA București National University for Science and Technology, Bukarest, Romania



 
Contact and Legal Notice · Contact Address:
Privacy Statement · Conference: IEEE ESTC 2024
Conference Software: ConfTool Pro 2.8.103+TC
© 2001–2024 by Dr. H. Weinreich, Hamburg, Germany