| Session | ||
Poster Session 2
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| Presentations | ||
Critical Parameters of Bond Strength Measurement on Wafer Bonding 1Yokohama National University, Yokohama, Germany; 2CYBERNET SYSTEMS CO., LTD. Investigating Competing Failure Modes in Microelectronics due to Temperature Variations (ΔT) 1TU Delft, Delft, The Netherlands; 2NXP Semiconductors N.V. (NXP) Development and Characterization of a Chip-film Patch Interposer Integrating an Ultrathin Electrophysiology Chip Institut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, Germany Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures up to 200 °C 1TU Dresden, Dresden Germany; 2Fraunhofer IZM ASSID, Moritzburg, Germany Using Polymer Paste as Dielectric Material for PCB Based Module-to-Module Sintering 1TUD Dresden University of Technology (IAVT), Dresden, Germany; 2Huawei Technologies Duesseldorf GmbH, Nuremberg Research Center, Nuremberg, Germany Non-phthalate and Biobased Plasticizers in Suspensions for Tape Casting 1Jozef Stefan Institute, Ljubljana, Slovenia; 2Keko-Equipment Ltd; 3CoE NAMASTE; 4International Postgraduate School, Ljubljana, Slovenia The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review Delft University of Technology, Delft, The Netherlands Simulation and Experimental Analysis of Thermomechanical Stresses Around Interconnects for W2W Hybrid Bonding 1College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China; 2International Joint Innovation Center, Zhejiang University, Haining, China; 3China Nanhu Academy of Electronics and Information Technology, Jiaxing, China; 4School of Integrated Circuits, East China Normal University, Shanghai, China RF Characterization and Analysis of Low-loss PCB Materials and Transmission Lines up to 110 GHz 1Fraunhofer IZM, Berlin, Germany; 2Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany; 3The Chemours Company, Newark, USA; 4KSG GmbH, Gornsdorf, Germany; 5Technical University Berlin (TUB), Berlin, Germany Bilayer Encapsulant for Lower Stress Moisture Protection University of Maryland, College Park, USA Laser Assisted Bonding (LAB) Based Flip-chip Process for Fine Pitch Solder Bumps Device Using Laser Non-conductive Paste (NCP) Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea) Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study University of West Bohemia, Plzeň, Czech Republic Experimental Study on Reactive Joining Processes on LTCC Substrates 1Saarland University, Saarbücken, Germany; 2TU Ilmenau, Illmenau, Germany Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-wafer Bonding Process IHP GmbH, Frankfurt Oder, Germany A Novel 8GHz/50MHz Low Noise Dual Frequency PLL. 1Saint Joseph University of Beirut, Beirut, Libanon; 2K. N. Toosi University of Technology, Tehran, Iran; 3Lebanese International University, Beirut, Libanon Innovative Active Cell Balancing Circuit Using Common Capacitor for Energy Redistribution 1Technical University of Cluj-Napoca, Cluj-Napoca, Romania; 2Eberspaecher Controls RO, Cluj-Napoca, Romania | ||