Conference Agenda

Critical Parameters of Bond Strength Measurement on Wafer Bonding

Yusuke Kondo¹, Junya Fuse¹, Yuki Yoshihara¹, Marie Sano¹, Yuzo Nakamura¹, Isamu Matsubara², Fumihiro Inoue¹

¹Yokohama National University, Yokohama, Germany; ²CYBERNET SYSTEMS CO., LTD.

Investigating Competing Failure Modes in Microelectronics due to Temperature Variations (ΔT)

Muhammad Musadiq¹, Adwait Inamdar¹, Romuald Roucou², W.D Van Driel¹

¹TU Delft, Delft, The Netherlands; ²NXP Semiconductors N.V. (NXP)

Development and Characterization of a Chip-film Patch Interposer Integrating an Ultrathin Electrophysiology Chip

Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz

Institut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, Germany

Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures up to 200 °C

Oliver Albrecht¹, Lukas Petersen¹, Luca Finn Tom Nowotnik¹, Maik Müller¹, Juliana Panchenko²

¹TU Dresden, Dresden Germany; ²Fraunhofer IZM ASSID, Moritzburg, Germany

Using Polymer Paste as Dielectric Material for PCB Based Module-to-Module Sintering

Tobias Tiedje¹, Jörg Meyer¹, Marco Luniak¹, Philip Knoch¹, Karsten Meier¹, Thomas Zerna¹, Andreas Munding²

¹TUD Dresden University of Technology (IAVT), Dresden, Germany; ²Huawei Technologies Duesseldorf GmbH, Nuremberg Research Center, Nuremberg, Germany

Non-phthalate and Biobased Plasticizers in Suspensions for Tape Casting

Kostja Makarovič^1,2,3, Barbara Malic^1,4

¹Jozef Stefan Institute, Ljubljana, Slovenia; ²Keko-Equipment Ltd; ³CoE NAMASTE; ⁴International Postgraduate School, Ljubljana, Slovenia

The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review

Zihan Zhang, Alireza Mehrabi, Willem vanDriel, René Poelma

Delft University of Technology, Delft, The Netherlands

Simulation and Experimental Analysis of Thermomechanical Stresses Around Interconnects for W2W Hybrid Bonding

Guoqiang Zhao^1,2,3, Yanping Zeng³, Yi Zhao^1,4

¹College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China; ²International Joint Innovation Center, Zhejiang University, Haining, China; ³China Nanhu Academy of Electronics and Information Technology, Jiaxing, China; ⁴School of Integrated Circuits, East China Normal University, Shanghai, China

RF Characterization and Analysis of Low-loss PCB Materials and Transmission Lines up to 110 GHz

Kavin Senthil Murugesan¹, Ivan Ndip^1,2, Jack Frankosky³, Brian Amos³, Georgi Georgiev⁴, Ralph Fiehler⁴, Jens Schneider¹, Martin Schneider-Ramelow^1,5

¹Fraunhofer IZM, Berlin, Germany; ²Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany; ³The Chemours Company, Newark, USA; ⁴KSG GmbH, Gornsdorf, Germany; ⁵Technical University Berlin (TUB), Berlin, Germany

Bilayer Encapsulant for Lower Stress Moisture Protection

Mohammed Ibaad Gandikota, Francis Patrick McCluskey

University of Maryland, College Park, USA

Laser Assisted Bonding (LAB) Based Flip-chip Process for Fine Pitch Solder Bumps Device Using Laser Non-conductive Paste (NCP)

Ki-Seok JANG, Yong-Sung EOM, Gwang-Mun CHOI, Jiho JOO, Jungho SHIN, Jin-Hyuk OH, Chan-Mi LEE, Ji-Eun JUNG, Ga-Eun LEE, Kwang-Seong CHOI

Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)

Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

University of West Bohemia, Plzeň, Czech Republic

Experimental Study on Reactive Joining Processes on LTCC Substrates

Erik Wiss¹, Nesrine Jaziri², Adam Yuile¹, Jens Müller², Steffen Wiese¹

¹Saarland University, Saarbücken, Germany; ²TU Ilmenau, Illmenau, Germany

Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-wafer Bonding Process

Patrick Krüger, Thomas Voß, Sebastian Schulze, Matthias Wietstruck

IHP GmbH, Frankfurt Oder, Germany

A Novel 8GHz/50MHz Low Noise Dual Frequency PLL.

Ahmad hatem Jadery¹, Mehdi Ehsanian², Elias Rachid¹, Adnan Harb³

¹Saint Joseph University of Beirut, Beirut, Libanon; ²K. N. Toosi University of Technology, Tehran, Iran; ³Lebanese International University, Beirut, Libanon

Innovative Active Cell Balancing Circuit Using Common Capacitor for Energy Redistribution

Ana Metes¹, Toma Patarau¹, Aurelian Kotlar²

¹Technical University of Cluj-Napoca, Cluj-Napoca, Romania; ²Eberspaecher Controls RO, Cluj-Napoca, Romania