Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
 
Session Overview
Session
Poster Session 2
Time:
Thursday, 12/Sept/2024:
10:30am - 11:45am

Session Chair: Karl-Friedrich Becker, Fraunhofer IZM
Location: Atrium

Exhibition

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Presentations

Critical Parameters of Bond Strength Measurement on Wafer Bonding

Yusuke Kondo1, Junya Fuse1, Yuki Yoshihara1, Marie Sano1, Yuzo Nakamura1, Isamu Matsubara2, Fumihiro Inoue1

1Yokohama National University, Yokohama, Germany; 2CYBERNET SYSTEMS CO., LTD.



Investigating Competing Failure Modes in Microelectronics due to Temperature Variations (ΔT)

Muhammad Musadiq1, Adwait Inamdar1, Romuald Roucou2, W.D Van Driel1

1TU Delft, Delft, The Netherlands; 2NXP Semiconductors N.V. (NXP)



Development and Characterization of a Chip-film Patch Interposer Integrating an Ultrathin Electrophysiology Chip

Michael Kübler, Alexander Frank, Ulrike Passlack, Christine Harendt, Joachim N. Burghartz

Institut für Mikroelektronik Stuttgart IMS CHIPS, Stuttgart, Germany



Reliability Analysis of Surface Mount Interconnect Technologies Suitable for Temperatures up to 200 °C

Oliver Albrecht1, Lukas Petersen1, Luca Finn Tom Nowotnik1, Maik Müller1, Juliana Panchenko2

1TU Dresden, Dresden Germany; 2Fraunhofer IZM ASSID, Moritzburg, Germany



Using Polymer Paste as Dielectric Material for PCB Based Module-to-Module Sintering

Tobias Tiedje1, Jörg Meyer1, Marco Luniak1, Philip Knoch1, Karsten Meier1, Thomas Zerna1, Andreas Munding2

1TUD Dresden University of Technology (IAVT), Dresden, Germany; 2Huawei Technologies Duesseldorf GmbH, Nuremberg Research Center, Nuremberg, Germany



Non-phthalate and Biobased Plasticizers in Suspensions for Tape Casting

Kostja Makarovič1,2,3, Barbara Malic1,4

1Jozef Stefan Institute, Ljubljana, Slovenia; 2Keko-Equipment Ltd; 3CoE NAMASTE; 4International Postgraduate School, Ljubljana, Slovenia



The Potential of Machine Learning for Thermal Modelling of SiC Power Modules - A Review

Zihan Zhang, Alireza Mehrabi, Willem vanDriel, René Poelma

Delft University of Technology, Delft, The Netherlands



Simulation and Experimental Analysis of Thermomechanical Stresses Around Interconnects for W2W Hybrid Bonding

Guoqiang Zhao1,2,3, Yanping Zeng3, Yi Zhao1,4

1College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China; 2International Joint Innovation Center, Zhejiang University, Haining, China; 3China Nanhu Academy of Electronics and Information Technology, Jiaxing, China; 4School of Integrated Circuits, East China Normal University, Shanghai, China



RF Characterization and Analysis of Low-loss PCB Materials and Transmission Lines up to 110 GHz

Kavin Senthil Murugesan1, Ivan Ndip1,2, Jack Frankosky3, Brian Amos3, Georgi Georgiev4, Ralph Fiehler4, Jens Schneider1, Martin Schneider-Ramelow1,5

1Fraunhofer IZM, Berlin, Germany; 2Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany; 3The Chemours Company, Newark, USA; 4KSG GmbH, Gornsdorf, Germany; 5Technical University Berlin (TUB), Berlin, Germany



Bilayer Encapsulant for Lower Stress Moisture Protection

Mohammed Ibaad Gandikota, Francis Patrick McCluskey

University of Maryland, College Park, USA



Laser Assisted Bonding (LAB) Based Flip-chip Process for Fine Pitch Solder Bumps Device Using Laser Non-conductive Paste (NCP)

Ki-Seok JANG, Yong-Sung EOM, Gwang-Mun CHOI, Jiho JOO, Jungho SHIN, Jin-Hyuk OH, Chan-Mi LEE, Ji-Eun JUNG, Ga-Eun LEE, Kwang-Seong CHOI

Electronics and Telecommunications Research Institute (ETRI), Daejeon, Republic of (South Korea)



Recycling SMD Components for E-Textile Fabrication: A Salt Spray Ageing Study

Martin Hirman, Jiri Navratil, Andrea Benesova, Frantisek Steiner

University of West Bohemia, Plzeň, Czech Republic



Experimental Study on Reactive Joining Processes on LTCC Substrates

Erik Wiss1, Nesrine Jaziri2, Adam Yuile1, Jens Müller2, Steffen Wiese1

1Saarland University, Saarbücken, Germany; 2TU Ilmenau, Illmenau, Germany



Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-wafer Bonding Process

Patrick Krüger, Thomas Voß, Sebastian Schulze, Matthias Wietstruck

IHP GmbH, Frankfurt Oder, Germany



A Novel 8GHz/50MHz Low Noise Dual Frequency PLL.

Ahmad hatem Jadery1, Mehdi Ehsanian2, Elias Rachid1, Adnan Harb3

1Saint Joseph University of Beirut, Beirut, Libanon; 2K. N. Toosi University of Technology, Tehran, Iran; 3Lebanese International University, Beirut, Libanon



Innovative Active Cell Balancing Circuit Using Common Capacitor for Energy Redistribution

Ana Metes1, Toma Patarau1, Aurelian Kotlar2

1Technical University of Cluj-Napoca, Cluj-Napoca, Romania; 2Eberspaecher Controls RO, Cluj-Napoca, Romania