Conference Agenda

Fabrication of Fine-Pitch Cu-Sn Microbumps Using Electroplating and Wet Seed Layer Etching

Yunfan Shi, Zilin Wang, Zheyao Wang

Tsinghua University, Tsinghua, China, People's Republic of

Eclipse Versus Conventional Optical Choppers: Modeling and Analysis

Virgil-Florin Duma¹, Eduard-Sebastian Csukas², Cosmin Moisa²

¹Polytechnic University of Timisoara, Timisoara, Romania; ²Continental Automotive, Romania

Development of HTC Tests on Module Basis

Victoria Zimmermann, Lukas Farnbacher, Tamara Reck, Dawei Zhao, Jürgen Leib, Bernd Eckardt

Fraunhofer IISB, Erlangen, Germany

Low-temperature Adhesive Wafer Bonding for Film Layer Transfer

Augusto Daniel Rodrigues^1,2, Nikolai Andrianov¹, Munir Syed Azeem¹, Madeleine Petschnigg¹, Tai Nguyen¹, Thang Duy Dao¹, Ali Roshanghias¹

¹Silicon Austria Labs GmbH, Austria; ²Carinthia University of Applied Sciences, Villach, Austria

Adhesive Solutions for Closed Cavity Packaging

Patrick Schirmer, Severin Ringelstetter

DELO Industrial Adhesives, Windach, Germany

Infrared Optical Solutions for Void Inspection of Bonded Wafers and Bonding Overlay Control

Gyorgy Nadudvari¹, Zsolt Kovács¹, Zoltan Tamas Kiss¹, Zoltan Lábszki¹, Imre Balogh¹, Silvia Poppa², Denes Szaz¹

¹Semilab, Budapest, Hungary; ²Semilab, Germany

Investigation of RF Characteristics of Chiplet to PCB Transitions for Advanced HPC Packaging Solutions

Alexander Gaebler¹, Uwe Maaß¹, Ivan Ndip^1,2

¹Fraunhofer IZM, Berlin, Germany; ²Brandenburg University of Technology (BTU) Cottbus-Senftenberg, Cottbus, Germany

Molding Process Simulation and Viscoelastic Model for Package Warpage Anticipation

Marco Rovitto

STMicroelectronics, Italy

2.5D/3D Chiplets Approach to Advanced Packaging Solutions

Hiroki Oshida¹, Tadashi Kubota¹, Engin Tinas², Yuichi Koba²

¹Towa Corporation, Japan; ²Towa Europe GmbH, Germany

Automatized Multi-objective Optimization for Reliability of Power Electronics

Tibor Debreceni¹, Bence Dániel Darázs¹, Christian Freitag², Bálint Garai²

¹Robert Bosch Kft., Budapest, Hungary; ²Robert Bosch GmbH, Germany

Adhesion Layer Analysis by Spectroscopic Ellipsometry

Uwe Richter

SENTECH Instruments GmbH, Berlin, Germany

Inline Oxide Removal Through Openair-plasma to Solve Delamination and Improve Bonding in Electronics

nico coenen, Dhia Bensalem, Daphne Pappas

Plasmatreat, Steinhagen, Germany

Heat Spreading in Uncovered Copper Sintered Die-Attach Layers Examined with Lock-In Thermography

Olaf Rämer¹, Marek Zajaczkowski², Corinna Grosse-Kockert², Daniel May², Sri Krishna Bhogaraju³

¹TU Berlin, Berlin, Germany; ²Berliner Nanotest und Design GmbH, Berlin, Germany; ³CuNex GmbH

Evaluation of Mobile Data Center Cooling Performance Based on Embedded Cooling

Yuxin Ye, Xiangbin Du, Chenxi Gao, Yanmei Kong, Guoran Lu, Xinhao Meng, Binbin Jiao

The Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China, People's Republic of